Journal of Navigation and Port Research 2005;29(10):871-876.
Published online December 31, 2005.
재료에 따른 반도체 압력 센서 배선의 피로 수명 평가에 관한 연구
심재준, 한동섭, 한근조, 이상석
A Study of Fatigue Lifetime Evaluation on the Interconnect of Semiconductor Pressure Sensor According to the Various Materials
Jae-Joon Shim, Dong-Seop Han, Geun-Jo Han, Sang-Suk Lee
Abstract
Application of semiconductor sensors has been widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors’s lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis. The Fatigue lifetime in its bottom is smaller than others and bending load have not an effect on the fatigue lifetime of the interconnect but the stress distribution.
Key Words: Semiconductor pressure sensor;Fatigue lifetime;Thermal load;Interconnect;Sensitivity


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